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SKU: 470-2005
Manufacturer part number: TG-G3.0-01
Brand: Gembird
Availability: 56 in stock

  Available for next day delivery

  Immediate collection available

  • Thermal compound (grease) for heatsinks
  • Helps the heat dissipation from a CPU or chipset
  • Excellent thermal inpedance
  • Perfect stability - it will not separate, run, or bleed
  • Non capacitive or electrically conductive
  • Thermal conductivity: > 4.5W / mK
  • Thermal indepance: <0.205C-in2/W
  • Evaporation: <0.001%
  • Volatility: 0.005%
  • Operating temperature: -50 ~240C
  • Composites: 50% Silicone, 30% Carbon, 20% metal oxides
  • 3g syringe
  • Thermal compound (grease) for heatsinks
  • Helps the heat dissipation from a CPU or chipset
  • Excellent thermal inpedance
  • Perfect stability - it will not separate, run, or bleed
  • Non capacitive or electrically conductive
  • Thermal conductivity: > 4.5W / mK
  • Thermal indepance: <0.205C-in2/W
  • Evaporation: <0.001%
  • Volatility: 0.005%
  • Operating temperature: -50 ~240C
  • Composites: 50% Silicone, 30% Carbon, 20% metal oxides
  • 3g syringe
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